AMAOE R40-012 Reballing Stencil for Motorola Moto Razr 40

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Motorola Moto Razr 40 (XT2323) foldable phone. The tool is engineered to work specifically on the phone’s middle layer motherboard, a key part of its complex, space-saving design. This stencil is essential for technicians performing component-level repairs on foldable devices.

Dedicated to Motorola Moto Razr 40: This stencil is a precision tool designed for the main ICs located in the middle layer of the Razr 40’s motherboard. The phone uses the Qualcomm Snapdragon 7 Gen 1 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made with the repair professional in mind.
Optimal Dimensions: The stencil’s size of 70x80mm is specifically tailored to fit the dimensions of the Razr 40’s motherboard, ensuring full coverage for the chips in the middle layer.