This is a breakdown of the AMAOE QU6 Universal Reballing Stencil, a specialized tool for working with a broad range of older and legacy Qualcomm processors and dedicated Baseband (Modem) chips.
AMAOE QU6 Stencil Overview
Key Stencil Features
Dual Functionality: The stencil supports both the main Qualcomm CPU/SoC and the dedicated Baseband (Modem) chips. This is essential for network-related repairs on older devices.
Precision Thickness: At 0.12mm, the stencil maintains the necessary precision for the BGA (Ball Grid Array) pads on these chips.
Anti-Bulging Design: As with other AMAOE stencils, it features a heat dissipation design to prevent the stencil from warping or lifting when heat is applied, ensuring a clean reballing process.
Supported Qualcomm Chipsets
The chips on this stencil are primarily from Qualcomm’s older MSM (Mobile Station Modem) and MDM (Mobile Data Modem) series.
Chip Part Number
Chip Type & Commercial Use
MDM9600
Dedicated 4G Baseband Modem. One of Qualcomm’s first integrated LTE modem chips.
MDM6600
Dedicated 3G Baseband Modem (EV-DO/HSPA+).
MDM8215 / MDM9215M
3G/4G Baseband Modem series, often paired with older Snapdragon CPUs.
MSM8909W
Snapdragon 210/212. An entry-level SoC used in budget 4G smartphones and tablets.
MSM7227
Snapdragon S1. An older, popular 3G SoC used in early low-end Android phones.
MSM6260 / MSM6246
Older 3G (HSDPA/UMTS) Baseband processors used in feature phones and early smartphones.
MSM7521
An older chip for 3G (CDMA/UMTS) devices.
QSC1110 / QSC1105
Very old, integrated chips primarily used in 2G/3G feature phones and basic budget devices.
QSC6270
Older 3G chip often used in feature phones.
Mobile Station Modems (MSM/QSC/SoC)
These chips combine the CPU and Modem into a System-on-a-Chip (SoC) and were used in a large number of mass-market 2G/3G Android and feature phones.
Chip Part Number
Chip Series / Commercial Name
Common Supporting Models / Device Examples
MSM8909W
Snapdragon 210 / Snapdragon Wear 2100
LG K4/K7, Microsoft Lumia 550/650, Various KaiOS feature phones (e.g., Nokia 6300 4G), and early smartwatches (Light Phone 2).
MSM7227
Snapdragon S1
HTC Wildfire S, LG Optimus One (P500), Samsung Galaxy Ace (S5830), Samsung Galaxy Gio, ZTE Blade, Sony Xperia J.
MSM7521
(Older 3G SoC)
Used in various CDMA/EV-DO handsets, typically older budget models from carriers like Sprint/Verizon.
MSM6260
(Older 3G SoC)
LG CU515/Trax, Pantech Matrix, Samsung Blackjack II, and various non-Android 3G feature phones.
MSM6246
(Older 3G SoC)
Similar to MSM6260, used in various 3G (WCDMA/HSDPA) phones from brands like LG and Huawei.
QSC1110
(Very Old Feature Phone Chip)
Used in basic 2G/3G CDMA feature phones or fixed wireless phones, such as the Huawei C6100 and Nokia 3806.
QSC1105(Corrected from OSC1105)
(Very Old Feature Phone Chip)
Similar to QSC1110, used in ultra-low-cost CDMA feature phones.
QSC6270
(Older 3G Feature Phone Chip)
Used in various CDMA/HSDPA feature phones and basic smart devices.
Dedicated Baseband Modems (MDM)
These chips are Modems only and were integrated into laptops, tablets, and dedicated network devices, or paired with a separate main CPU in a phone/tablet.
Chip Part Number
Chip Function / Modem Generation
Common Applications
MDM9600
4G LTE (Cat 3)Modem
Used in first-generation 4G LTE USB dongles, Mobile Hotspots (MiFi devices), and LTE modules integrated into older tablets/laptops.
MDM9215M
4G LTE Modem
A later version of the 4G modem, used in early LTE tablets, hotspots, and routers (often paired with a non-Qualcomm CPU).
MDM8215
3G/4G HSPA+Modem
Used in mobile broadband modules, tablets, and M2M (Machine-to-Machine) devices.
MDM6600
3G EV-DO/HSPA+Modem
Used in older 3G Mobile Hotspots, data cards, and early tablet models.
Technical Specifications:
Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
shipping & delivery
Shipping & Delivery information :
Shipping Charges: A shipping fee of RS 80 will be applied to orders
Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.
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