Product Description: AMAOE QU4 Stencil (Qualcomm CPU/RAM Series) – 0.12mm Superhard BGA Reballing Net

Short Description (for product listings/category pages):

High-precision AMAOE QU4 (Qualcomm CPU/RAM) 0.12mm reballing stencil. Essential for professional BGA reballing and motherboard repair of classic flagship Snapdragon processors, including the Snapdragon 810 (MSM8994), 800/801 (MSM8974), and S4 Plus (MSM8960) series.

Full Product Description (for the product page):

AMAOE QU4 (Qualcomm CPU/RAM) Reballing Stencil – Professional Motherboard Rework

The AMAOE QU4 Stencil from the Superhard Series ($超硬系列$) is a must-have, high-precision tool for any professional mobile phone repair technician dealing with classic Android flagship devices. Engineered with a durable 0.12mm thickness and cooling holes for superior performance, this BGA reballing net ensures perfect alignment and consistent solder ball application for some of the most common and powerful Qualcomm Snapdragon processors.

Key Features and Benefits:

• Ultra-Thin 0.12mm Precision: Guarantees crisp, clean solder balls and perfect alignment on tiny BGA pads.
• Superhard Material: Made from Japanese steel, providing exceptional durability and resistance to warping under heat, ensuring long-term reuse.
• Cooling Hole Design: Features an anti-drum, cooling hole pattern for quick heat dissipation and improved reballing success rates.
• Targeted Compatibility: Specifically designed for BGA reballing of several generations of classic Qualcomm Snapdragon CPU and RAM chips, widely used in older flagship phones.

Supported Chipsets (MSM Series):

This stencil features precise cutouts for both the CPU and the corresponding DDR RAM chips, allowing for accurate reballing of stacked components:

• MSM8994 B (CPU) & MSM8994 A (RAM): For devices featuring the Snapdragon 810 (e.g., Sony Z5, Nexus 6P, HTC M9).
• MSM8974 B (CPU) & MSM8974 A (RAM): For devices featuring the Snapdragon 800/801 (e.g., Samsung S5, Nexus 5, OnePlus One).
  • Also Generic for MSM8274/8674 variants.
• MSM8960 B (CPU) & MSM8960 A (RAM): For devices featuring the Snapdragon S4 Plus (e.g., HTC One S, Nokia Lumia 920).

Why Choose the AMAOE QU4 Stencil?

Avoid guesswork and generic tools. The AMAOE QU4 is precisely etched to match the exact BGA footprint of these widely used Qualcomm chips, making your complex motherboard repairs faster, more reliable, and ultimately more profitable. Upgrade your rework station with this essential, dedicated reballing tool.

The codes you listed appear to be various models of Qualcomm Snapdragon System-on-Chips (SoCs), which integrate the CPU, GPU, and other components. The “B” or “A” suffix in your list might refer to a specific variant or component of the entire SoC.

Here is a breakdown of the corresponding commercial names for these SoCs and examples of devices they powered:

Note on Suffixes (A/B):

• The naming convention like MSM8994 A RAM or MSM8994 B CPU is not a standard, publicly used naming scheme by Qualcomm. These types of distinctions often refer to:
  • Specific internal manufacturing or component revisions.
  • Different part numbers for the CPU cluster, modem, or memory controller within the same SoC family.
  • In the case of MSM8974, the various revisions like MSM8974AA, MSM8974AB, and MSM8974ACcorrespond to different clock speeds and are branded as Snapdragon 800 or 801.

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes