AMAOE QU:1 Stencil Supported CPU List MSM8996 MSM8976 MSM8992
AMAOE QU:1 Stencil Supported CPU List MSM8996 MSM8976 MSM8992
FeatureDetailBrandAMAOE (阿毛易修®)ModelQU:1TypeMulti-Function Qualcomm CPU BGA Reballing Stencil (Plant Tin Steel Net)Thickness0.12mm (Ultra-thin for high precision)MaterialSuper Hard Japanese Steel Sheet (Stainless Steel)
AMAOE QU:1 Stencil Supported CPU List
The AMAOE QU:1 stencil is designed for reballing (repairing) several older, high-end, and popular Qualcomm Snapdragon processors, covering both the main CPU and related components (often referred to as ‘A’ and ‘B’ variants, which can sometimes denote CPU/RAM or top/bottom layer sections).
Qualcomm Model (MSM)
Commercial Name (Snapdragon)
Common Example Devices
MSM8996 A / B
Snapdragon 820 / 821
Samsung Galaxy S7 (US/China), Google Pixel, OnePlus 3/3T, LG G5, Xiaomi Mi 5.
MSM8976 A / B
Snapdragon 652
Samsung Galaxy A9 (2016), LG G5 SE, Xiaomi Redmi Note 3 Pro.
MSM8992 A / B
Snapdragon 808
LG G4, Nexus 5X, Xiaomi Mi 4c.
MSM8976 通用 8956
Snapdragon 650 / 652
Indicates the stencil is compatible with both the MSM8976 and the similar MSM8956/Snapdragon 650, which often share the same ball array layout.
Key Product Features Highlighted on the Stencil:
Thickness:0.12MM
Material:Superhard (選硬系列) steel sheet.
Design:Half-etching shading design (半刻遮挡设计) and anti-drumming design for heat dissipation holes (散热孔防起鼓设计). These features ensure precise solder paste application and prevent the stencil from warping when exposed to heat during the reballing process.
Purpose: The stencil is a core tool for CPU BGA rework and reballing on mobile phone mainboards.
supporting list for those Qualcomm CPUs:
Qualcomm Model
Commercial Name
CPU Core Information
Common Devices (Examples)
MSM8996
Snapdragon 820
Quad-core Kryo CPU
Samsung Galaxy S7 (US/China models), LG G5, HTC 10, OnePlus 3, Sony Xperia XZ, Xiaomi Mi 5.
MSM8996 RAM
LPDDR4
The accompanying RAM chip (often stacked on the CPU – PoP) for MSM8996.
Same devices as MSM8996.
MSM8976
Snapdragon 652
Octa-core (4x Cortex-A72 + 4x Cortex-A53)
Samsung Galaxy A9 (2016), LG G5 SE, BQ Aquaris X5 Plus, ZTE Axon 7 Mini.
MSM8976 RAM
LPDDR3
The accompanying RAM chip (often stacked on the CPU – PoP) for MSM8976.
Same devices as MSM8976.
MSM8992
Snapdragon 808
Hexa-core (2x Cortex-A57 + 4x Cortex-A53)
LG G4, Google/LG Nexus 5X, Microsoft Lumia 950, Xiaomi Mi 4c.
MSM8992 RAM
LPDDR3
The accompanying RAM chip (often stacked on the CPU – PoP) for MSM8992.
Same devices as MSM8992.
Technical Specifications:
Material: Stainless Steel
Pattern: Square
Dimensions (W x H): 10 x 8 cm
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
shipping & delivery
Shipping & Delivery information :
Shipping Charges: A shipping fee of RS 80 will be applied to orders
Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.
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