AMAOE MZ201-012 Reballing Stencil for Meizu 20 INFINITY

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Meizu 20 INFINITY Unlimited Edition. The tool is specifically engineered for the phone’s middle layer motherboard, a key part of its complex and space-saving design. This stencil is essential for technicians performing component-level repairs on this flagship device.

Dedicated to Meizu 20 INFINITY (中层): This stencil is a precision tool designed for the main ICs located in the middle layer of the Meizu 20 INFINITY’s motherboard. The phone uses the Qualcomm Snapdragon 8 Gen 2chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Optimal 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Made with Professional Experience: The “AMAOE Easy Repair” brand promise, “Tools made with the repairman’s experience in mind,” guarantees a reliable and effective product that solves real-world repair challenges.
Material: Stainless Steel
Pattern: Square
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes