AMAOE Stencil MTK CPU MU:3 0.12mm

AMAOE MU3 Stencil MTK CPU MU:3 0.12mm

Detailed Product Confirmation (AMAOE MU:3 Stencil)

Feature	Specification / Detail
Model	MU:3 (MTK CPU 综合网 -MU3)
Tool Type	BGA Reballing Stencil (also known as a “tin planting net” or “steel mesh”).
Material/Design	“日本” (Japan) Steel Sheet (often a hardened, high-temperature resistant alloy).
Thickness	$0.12 mm$ (Ultra-thin, required for precision reballing of fine-pitch CPU chips).
Key Design Feature	“散热孔防超皷设计” (Cooling hole and anti-drum/anti-bulge design) – This feature helps dissipate heat and prevents the stencil from warping or sticking to the chip during the soldering process.

Confirmed Supported MediaTek (MTK) CPUs:

The labels explicitly confirm that this stencil supports the following MediaTek SoCs:

MT6762V (Commercial Name: Helio P22)
MT6739V
MT6757V (Commercial Name: Helio P25)
MT6771V (Commercial Name: Helio P60)
MT6763V (Commercial Name: Helio P23)

Purpose: This stencil allows technicians to accurately and uniformly apply solder paste to the contact pads of the listed MTK CPU chips, preparing them to be re-soldered onto a device’s motherboard.

MediaTek CPU Model Support List

Here are the commercial names for the MTK CPU models you listed:

Model Number	Commercial Name (Helio Series)	Classification / Key Feature
MT6762V	Helio P22	Mainstream Octa-Core chip, often used in budget to mid-range phones.
MT6771V	Helio P60	Mid-range Octa-Core chip with a powerful $CPU$ and a dedicated $AI Processing Unit (APU)$ .
MT6763V	Helio P23	Mid-range Octa-Core chip, known for efficiency and supporting dual-camera setups.
MT6757V	Helio P20	Mid-range Octa-Core chip built on a power-efficient $16 nm$ process.
MT6739V	(No specific Helio name)	Entry-level Quad-Core chip, focused on very affordable $4 G LTE$ devices.

Context: The “V” suffix typically denotes a variant of the base chip with a specific package or configuration (e.g., maximum clock speed or memory support), but the core architecture and commercial name remain the same. The $AMAOE MU:3$ stencil is designed for reballing these specific $MTK$ chips.