“S21+ SM-G996U G996O G996D G996W MIDDLE LAYER STENCIL” has been added to your cart. View cart
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Xiaomi 15 Ultrasmartphone. The tool is engineered to work specifically on the phone’s middle layer motherboard, which is a key part of its complex, space-saving design. This stencil is essential for technicians performing component-level repairs on this flagship device.
Dedicated to Xiaomi 15 Ultra (中层): This stencil is a precision tool specifically designed for the main ICs located in the middle layer of the Xiaomi 15 Ultra’s motherboard. The phone is expected to use the Qualcomm Snapdragon 8 Gen 4 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Unique Dimensions (80x100mm): Unlike standard 70x70mm stencils, this tool is custom-sized to perfectly fit the unique layout of the Xiaomi 15 Ultra’s motherboard. This ensures full coverage and stability for all middle-layer components.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Optimal 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool.
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
AMAOE M15U-012 Reballing Stencil for Xiaomi 15 Ultra
This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Xiaomi 15 Ultrasmartphone. The tool is engineered to work specifically on the phone’s middle layer motherboard, which is a key part of its complex, space-saving design. This stencil is essential for technicians performing component-level repairs on this flagship device.
Dedicated to Xiaomi 15 Ultra (中层): This stencil is a precision tool specifically designed for the main ICs located in the middle layer of the Xiaomi 15 Ultra’s motherboard. The phone is expected to use the Qualcomm Snapdragon 8 Gen 4 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Unique Dimensions (80x100mm): Unlike standard 70x70mm stencils, this tool is custom-sized to perfectly fit the unique layout of the Xiaomi 15 Ultra’s motherboard. This ensures full coverage and stability for all middle-layer components.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Optimal 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool.
Material: Stainless Steel
Pattern: Square
Thickness: 0.12mm
Color: Silver
Item Weight: 50 g
Country of Origin: China
Net Quantity: 1
Reusable: Yes
shipping & delivery
Shipping & Delivery information :
Shipping Charges: A shipping fee of RS 80 will be applied to orders
Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.
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