AMAOE IP16/PL-012 Reballing Stencil for iPhone 16/16 Plus

This is a professional-grade reballing stencil from AMAOE, designed for advanced and highly specific repairs. It is engineered to work on the middle layer of the iPhone 16 and 16 Plus motherboards, which utilize a complex “sandwich” design. This tool is essential for technicians who perform component-level repairs on Apple’s latest devices.

• Dedicated to iPhone 16/16 Plus (中层): This stencil is a precision tool specifically designed for the middle layer where the Apple A18 chipset is located. A dedicated stencil is crucial for a successful repair on this type of multi-layer board.
• Strong Magnetic Properties (强磁性): The stencil’s strong magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
• Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
• Made with Professional Experience: The “AMAOE Easy Repair” brand promise, “Tools made with the repairman’s experience in mind,” guarantees a reliable and effective product that solves real-world repair challenges.