AMAOE BGA Reballing Stencil – Snapdragon 7 Gen 3 (SM7550) | 0.12mm Strong Magnetic

AMAOE BGA Reballing Stencil – Snapdragon 7 Gen 3 (SM7550) | 0.12mm Strong Magnetic

Product Title AMAOE Qualcomm Snapdragon 7 Gen 3 (SM7550) BGA Reballing Stencil – 0.12mm

Short Description High-precision AMAOE 0.12mm magnetic BGA reballing stencil engineered specifically for the Qualcomm Snapdragon 7 Gen 3 (SM7550) CPU. Features an anti-bulging heat dissipation hole design for clean, accurate, and deformation-free chip reballing.

Full Product Description Upgrade your motherboard micro-soldering workflow with the AMAOE SM7550 BGA Reballing Stencil, custom-built for the Qualcomm Snapdragon 7 Gen 3 (SM7550) processor. Designed from the technician’s perspective, this stencil delivers pinpoint pad alignment and consistent solder ball formation during CPU repair and reballing.

Key Features:

• Exact Chipset Compatibility: Precision-cut specifically for the Qualcomm Snapdragon 7 Gen 3 (SM7550 / SM7550-AB) processor.

• Anti-Bulging Heat Dissipation Design: Surrounded by strategically placed circular vent holes (散热孔防起鼓设计) that evenly distribute hot air and prevent the stencil from warping or bulging under high reballing temperatures.

• Strong Magnetic Grade (强磁性): Manufactured from high-grade magnetic stainless steel that holds firmly onto magnetic reballing fixtures, preventing solder paste bleeding or shifting during heating.

• Optimal 0.12mm Thickness: Balances durability with effortless solder paste application and smooth stencil release.

Technical Specifications

Compatible Smartphone Models (Reference)

• Vivo V30 / V40

• OnePlus Nord CE4

• Motorola Edge 50 Pro

• Honor 100 / Honor 200

• iQOO Z9 (Snapdragon 7 Gen 3 variant) / Z9s Pro

• HTC U24 Pro

SEO Tags / Keywords AMAOE SM7550 stencil, Snapdragon 7 Gen 3 BGA stencil, SM7550 CPU reballing stencil, AMAOE 40003498, 0.12mm mobile IC stencil, Qualcomm SM7550-AB stencil, OnePlus Nord CE4 CPU stencil, Vivo V30 CPU stencil

AMAOE BGA Reballing Stencil – Snapdragon 7 Gen 3 (SM7550) | 0.12mm Strong Magnetic

Enhance your mobile motherboard repair precision with the high-quality AMAOE BGA Reballing Stencil, specifically engineered for the Qualcomm Snapdragon 7 Gen 3 (SM7550) IC. Manufactured with premium materials and advanced design features, this stencil ensures accurate alignment and flawless reballing results for professional technicians.

Key Features:

• Processor Compatibility: Designed precisely for the Qualcomm Snapdragon 7 Gen 3 (SM7550) chipset.

• Precision Thickness: 0.12mm thickness provides the ideal balance for optimal solder paste application and structural integrity.

• Strong Magnetic Design: Built with strong magnetic properties to hold securely in place on compatible magnetic reballing platforms/fixtures during alignment and heating.

• Anti-Bulge Thermal Design: Features specialized heat dissipation holes and an anti-bulge design to prevent warping or deformation under high hot-air gun temperatures.

• Durable Build: High-grade alloy construction resistant to wear, ensuring long-lasting performance for daily repair work.

Specifications:

• Brand: AMAOE

• Compatible IC: Snapdragon 7 Gen 3 / SM7550

• Stencil Thickness: 0.12 mm

• Special Features: Strong Magnetic, Anti-Bulge Heat Dissipation Holes