binumobiles
Adress
-
Binu Mobiles -
No. 6/429-c (12)
Land Ship Mall,
Mavoor Road Junction,
Kozhikode, Pin - 673001 -
(+91) 9895333473
Mobileicbinu@gmail.com
Products
apple device stencil | mobile phones stencil
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User Deals: binumobiles
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Supported ICs & Slot Layout
| Slot # | Label on Stencil | Chipset / Component Details |
| 1 | 麒麟Kirin9020-Hi36C0 | Huawei HiSilicon Kirin 9020 CPU (Hi36C0) |
| 2 | SE3-A15 | Apple iPhone SE (3rd Gen) A15 Bionic CPU |
| 3 | A18 | Apple A18 Bionic CPU |
| 4 | A18 Pro (printed as A18 Rro) | Apple A18 Pro Bionic CPU |
| 5 | 天玑8400-MT6899Z | MediaTek Dimensity 8400 CPU (MT6899Z) |
| 6 | RAM496 | 496-Ball Mobile LPDDR RAM Package |
| 7 | 麒麟Kirin8000-Hi6290 V110 | Huawei HiSilicon Kirin 8000 CPU (Hi6290 V110) |
| 8 | 麒麟Kirin9000S-Hi36A0-V120 | Huawei HiSilicon Kirin 9000S CPU (Hi36A0 V120) |
Technical Specifications
- Brand: AMAOE (阿毛易修)
- Series: UBGA Reballing Expert Series (UBGA-植锡专家系列)
- Model: U-MIXU2
- Type: Hybrid CPU Collection Stencil (混合-CPU 集合网)
- Thickness: 0.12mm
- Patent Number: ZL2016213989365
- Barcode / SKU Reference: 41011879
Deal
Technical Specifications
Specification |
Details |
Brand |
AMAOE (阿毛易修) |
Model Number |
U-SMU4 |
Series |
UBGA Reballing Expert Series |
Stencil Thickness |
0.12mm |
Barcode / SKU ID |
41012612 |
Patent Number |
ZL2016213989365 |
Application |
Samsung Exynos Mobile Motherboard CPU & RAM Reballing |
Deal
Attribute |
Details |
Brand |
AMAOE (阿毛易修) |
Model |
SAM:22 |
Series |
Superhard (超硬系列) |
Thickness |
0.12mm |
Primary Compatibility |
Samsung Galaxy A17 & other MT6789V / SM6475 / MT6769V models |
Barcode / Part No. |
41012779 |
Patent Number |
ZL2016213989365 |
Deal
Specifications:
-
Brand: AMAOE
-
Compatible IC: Snapdragon 7 Gen 3 / SM7550
-
Stencil Thickness: 0.12 mm
Deal
Product Specifications:
| Feature | Details |
| Brand | AMAOE (阿毛易修) |
| Model | U-MIXU3 |
| Version | V3.0 |
| Series | UBGA Mixed CPU Series |
| Thickness | 0.12MM |
| Barcode / Serial Code | 41012669 |
| Patent Number |
ZL2016213989365 U-MIXU3_Stencil
2026-02-08 A-Mao Repair
Snapdragon 8 Elite Gen 5 (SM8850), Snapdragon 7 Gen 4 (SM7750), RAM496, Dimensity 9500 (MT6993Z)
Snapdragon 8 Gen 5 (SM8845), Snapdragon 8s Elite (SM8735), Dimensity 8400 (MT6899Z), Snapdragon 8 Elite Gen 5 (SM8850)
|
Deal
AMAOE U-GGE1 GOOGLE PIXEL CPU STENCIL
- 1: G5
- 2: G3
- 3: G2
- 4: RAM 496
- 5: G4-F1KZ1Y04
- 6: G4-P050510513
- 7: Tensor 0010310614
- 8: Tensor
Deal
AMAOE CPU BGA REBALLING STENCIL BGA245
Amaoe 0.15mm BGA245 IC Chip BGA Reballing Stencil
PACKAGE INCLUDES: 1 X STENCIL
Deal
Tensor G3 CPU_Steel mesh Stencil GOOGLE TENSOR G3 STENSIL
Technical Specifications
Deal
E8855 CPU STENCIL AMAOE EXYNOS1580/SAMSUNG E8855 STENCIL
AMAOE 0.12MM CPU BGA REBALLING STENCIL FOR SAMSUNG EXYNOS 1580 PACKAGE INCLUDES: 1 X STENCIL
Deal
AMAOE S24FE-012 S24 FE SM-S721B/BE/U STENCIL
PACKAGE INCLUDES:
1 X STENCIL S24FE STENCIL MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG GALAXY S24 FE SM-S721B / BE / U
Deal
AMAOE UNI1 BGA STENCIL
U-UNI1
SGM41512
2233
UMW2651
BGA221
BGA153
BGA254
UMP510G
UWP51065
UIS8910
UMS9230H
UMS512T
R818
SR3595D
RR88643-21
RPM6743-31
UIP8910
UMW2652
RR88916
BGA200
SR3595D
Deal
AMAOE CD3217 4-in-1 MacBook USB-C Controller Reballing Stencil
Feature |
Specification |
Supported ICs |
CD3217, CD3215, CD3218, TPS6598x series |
Compatible Devices |
MacBook Pro & Air (USB-C Models), iMac, Mac Mini |
Stencil Thickness |
0.12mm (Optimized for small IC thermal stability) |
Material |
High-Grade Imported Stainless Steel |
Hole Design |
Precision CNC Square Holes |
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