binumobiles
Adress
-
Binu Mobiles -
No. 6/429-c (12)
Land Ship Mall,
Mavoor Road Junction,
Kozhikode, Pin - 673001 -
(+91) 9895333473
Mobileicbinu@gmail.com
Products
apple device stencil | mobile phones stencil
User Posts: binumobiles
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User Deals: binumobiles
Deal
AMAOE UNI1 BGA STENCIL
U-UNI1
SGM41512
2233
UMW2651
BGA221
BGA153
BGA254
UMP510G
UWP51065
UIS8910
UMS9230H
UMS512T
R818
SR3595D
RR88643-21
RPM6743-31
UIP8910
UMW2652
RR88916
BGA200
SR3595D
Deal
AMAOE CD3217 4-in-1 MacBook USB-C Controller Reballing Stencil
Feature |
Specification |
Supported ICs |
CD3217, CD3215, CD3218, TPS6598x series |
Compatible Devices |
MacBook Pro & Air (USB-C Models), iMac, Mac Mini |
Stencil Thickness |
0.12mm (Optimized for small IC thermal stability) |
Material |
High-Grade Imported Stainless Steel |
Hole Design |
Precision CNC Square Holes |
Deal
IPBB:2 Qualcomm version
8-X Qualcomm baseband
XR/XS baseband
11 baseband
12 baseband
13 baseband
14/15/16 baseband
7/8/X baseband
A10 CPU
A18 CPU
A16 CPU
A14 CPU
A12 CPU
A11 CPU
A18Pro CPU
A17 CPU
A15 CPU
A13 CPU
BGA315
11 WIFI
12/ 13/14 WIFI
XS WIFI
BGA70
BGA110
7/7PÂ NFC
8/8P/X NFC
 XR/XS NFC
11-13 NFC
14 NFC
16 NFC
15USBÂ
15 WIFI
16WIFT
7/ 8/ X/ XR WIFI
IP7-16 board transfer net - 0.12MM
Deal
IP7–14 Small Components Network Stencil – Baseband / NAND / WiFi / NFC SUPPORTED ICS, CPU
7/7P Qualcomm Baseband
8-X Qualcomm Baseband
XS/XSM/XR Baseband
11 Baseband
12 Baseband
13 Baseband
7/7P Intel Baseband
BGA 70 NAND
BGA 110 NAND
BGA315
8-X Intel Baseband
7/8/X/XR Wi-Fi IC
XS/XSM Wi-Fi IC
11 Wi-Fi IC
12/13 Wi-Fi ICÂ
14 Wi-Fi ICÂ
14 Baseband
7/7P NFC IC
8/8P/X NFC IC
14 NFC
XS/XSM/XR NFC IC
11-14 NFC
IP7-14 Small Components Network - Baseband/Hard Drive NAND /WiFi/NFC/Chip STENCIL - 0.12MM
Deal
AMAOE OV9 – SUPPORTED ICS, CPU
OV : 9
VC7643
58255
58081
77048E
MT6195W
MT6639AEW
POMF3600
BGA153
MT6985W RAM
MT6985W CPU
P9415
MT6376P
MT6373DW
MT6363FW
SC8571
6338W
Dimensity 9200 MT6985W CPU General Series - 0.12MM
FOR Vivo X90/90Pro/90s, OPPO Find X6, iQ Neo8PRO
Deal
AMAOE U-OSU1 – SUPPORTED ICS, CPU
Snapdragon 835-MSM8998
MSM8274
MSM8674
MSM8974
Snapdragon 650-MSM8956
Snapdragon 652-MSM8976
Snapdragon 820-MSM8996
MSM8998RAM
Snapdragon 808-MSM8992
RAM256
RAM366 Heat dissipation hole anti-bulging design
Qualcomm - CPU Collection Network - 0.12MM
U-QSU1 0.12MM
Deal
AMAOE SAM21 – SUPPORTED ICS, CPU
SAM: 21
58093-11
QPM7815A
WCN7851
MRX77775P
SM8750 CPU
SDR875
BGA153
SM8750
RAM496
PE442
TRFK2701
PM8550VE
8550VS
CPS4038
Snapdragon 8 Ultra SM8750 CPU Universal Series - 0.12MM
Compatible with: Samsung S25/25+, etc.
SAM:21 0.12MM
Deal
AMAOE X6P+ STENCIL FOR VIVO X60 PRO PLUS MIDDLE LAYER STENCIL X60PRO+
Deal
AMAOE IQ9P-012 BGA REBALLING STENCIL FOR IQOO 9PRO
Deal
IQ007 Amaoe IQ7-012 Middle Layer BGA Reballing Stencil for VIVO IQOO 7
Deal
​​S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
Sale
S25ULTRA S9380 Middle Layer BGA Reballing Stencil for S25 ULTRA
Original price was: ₹351.00.₹350.00Current price is: ₹350.00. -0%S25ULTRA S9380 Middle Layer BGA Reballing Stencil for S25 ULTRA
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