SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus
AMAOE SAM21 – SUPPORTED ICS, CPU
SAM: 21
58093-11
QPM7815A
WCN7851
MRX77775P
SM8750 CPU
SDR875
BGA153
SM8750
RAM496
PE442
TRFK2701
PM8550VE
8550VS
CPS4038
Snapdragon 8 Ultra SM8750 CPU Universal Series – 0.12MM
Compatible with: Samsung S25/25+, etc.
SAM:21 0.12MM
₹300.00
SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 / S25 Plus

SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 / S25 Plus
AMAOE SAM21 – SUPPORTED ICS, CPU
SAM: 21
58093-11
QPM7815A
WCN7851
MRX77775P
SM8750 CPU
BGA153
SDR875
SM8750
RAM496
PE442
TRFK2701
PM8550VE
8550VS
CPS4038
Snapdragon 8 Ultra SM8750 CPU Universal Series – 0.12MM
Compatible with: Samsung S25/25+, etc.
SAM:21 0.12MM
AMAOE SAM21 BGA REBALLING STENCIL (0.12MM) – SAMSUNG S25 / S25 PLUS
THE AMAOE SAM21 IS A SPECIALIZED, ULTRA-PRECISE REBALLING STENCIL DESIGNED FOR THE NEXT GENERATION OF MOBILE REPAIR. IT IS SPECIFICALLY ENGINEERED TO HANDLE THE QUALCOMM SM8750 (SNAPDRAGON 8 ELITE / GEN 4) CPU FOUND IN THE SAMSUNG GALAXY S25 AND S25 PLUS SERIES. THIS PROFESSIONAL-GRADE TOOL ENSURES PERFECT ALIGNMENT FOR ONE OF THE MOST ADVANCED CHIPSETS ON THE MARKET.
KEY PRODUCT SPECIFICATIONS
MODEL: AMAOE SAM21 (SAM:21)
APPLICATION: BGA REBALLING FOR SAMSUNG GALAXY S25 / S25+
TARGET IC: QUALCOMM SM8750 (SNAPDRAGON 8 ELITE) CPU AND RAM
THICKNESS: 0.12MM (ULTRA-THIN FOR HIGH-PRECISION SOLDERING)
MATERIAL: HIGH-QUALITY JAPANESE IMPORTED STEEL (ANTI-DEFORMATION)
DESIGN: FEATURES AMAOE’S PATENTED SQUARE HOLE MESH FOR UNIFORM SOLDER DISTRIBUTION.
ADVANCED DESIGN FEATURES
HEAT DISSIPATION & ANTI-BULGING: INCLUDES SPECIALIZED CIRCULAR RELIEF HOLES (散热孔防起鼓设计) THAT PREVENT THE STENCIL FROM WARPING OR “BULGING” WHEN EXPOSED TO HIGH TEMPERATURES FROM A HEAT GUN.
HIGH-TEMPERATURE RESISTANCE: DESIGNED TO WITHSTAND THE RIGOROUS THERMAL DEMANDS OF MODERN LEAD-FREE REBALLING WITHOUT LOSING ITS STRUCTURAL INTEGRITY.
PRECISION ALIGNMENT: THE HOLE LAYOUT IS CNC-MILLED TO PERFECTLY MATCH THE DENSE BALL GRID ARRAY (BGA) OF THE SM8750, ENSURING NO BRIDGING OR COLD SOLDER JOINTS.
POLISHED FINISH: THE STENCIL SURFACE AND HOLES ARE SPECIALLY TREATED TO ALLOW FOR EASY RELEASE OF SOLDER PASTE, REDUCING CLEANUP TIME AND INCREASING SUCCESS RATES.
Technical Specifications:
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Material: Stainless Steel
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Pattern: Square
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Dimensions (W x H): 10 x 8 cm
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Thickness: 0.12mm
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Color: Silver
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Item Weight: 50 g
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Country of Origin: China
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Net Quantity: 1
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Reusable: Yes
shipping & delivery
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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
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SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus
₹300.00







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