SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus

AMAOE SAM21 – SUPPORTED ICS, CPU

SAM: 21

58093-11

QPM7815A

WCN7851

MRX77775P

SM8750 CPU

SDR875

BGA153

SM8750

RAM496

PE442

TRFK2701

PM8550VE

8550VS

CPS4038

Snapdragon 8 Ultra SM8750 CPU Universal Series – 0.12MM

Compatible with: Samsung S25/25+, etc.

SAM:21 0.12MM

300.00

Added to wishlistRemoved from wishlist 0
Add to compare

SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 / S25 Plus

 

SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 / S25 Plus

SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 / S25 Plus

AMAOE SAM21 – SUPPORTED ICS, CPU

SAM: 21

58093-11

QPM7815A

WCN7851

MRX77775P

SM8750 CPU

BGA153

SDR875

SM8750

RAM496

PE442

TRFK2701

PM8550VE

8550VS

CPS4038

Snapdragon 8 Ultra SM8750 CPU Universal Series – 0.12MM

Compatible with: Samsung S25/25+, etc.

SAM:21 0.12MM



AMAOE SAM21 BGA REBALLING STENCIL (0.12MM) – SAMSUNG S25 / S25 PLUS
THE AMAOE SAM21 IS A SPECIALIZED, ULTRA-PRECISE REBALLING STENCIL DESIGNED FOR THE NEXT GENERATION OF MOBILE REPAIR. IT IS SPECIFICALLY ENGINEERED TO HANDLE THE QUALCOMM SM8750 (SNAPDRAGON 8 ELITE / GEN 4) CPU FOUND IN THE SAMSUNG GALAXY S25 AND S25 PLUS SERIES. THIS PROFESSIONAL-GRADE TOOL ENSURES PERFECT ALIGNMENT FOR ONE OF THE MOST ADVANCED CHIPSETS ON THE MARKET.

KEY PRODUCT SPECIFICATIONS

MODEL: AMAOE SAM21 (SAM:21)

APPLICATION: BGA REBALLING FOR SAMSUNG GALAXY S25 / S25+

TARGET IC: QUALCOMM SM8750 (SNAPDRAGON 8 ELITE) CPU AND RAM

THICKNESS: 0.12MM (ULTRA-THIN FOR HIGH-PRECISION SOLDERING)

MATERIAL: HIGH-QUALITY JAPANESE IMPORTED STEEL (ANTI-DEFORMATION)

DESIGN: FEATURES AMAOE’S PATENTED SQUARE HOLE MESH FOR UNIFORM SOLDER DISTRIBUTION.

ADVANCED DESIGN FEATURES

HEAT DISSIPATION & ANTI-BULGING: INCLUDES SPECIALIZED CIRCULAR RELIEF HOLES (散热孔防起鼓设计) THAT PREVENT THE STENCIL FROM WARPING OR “BULGING” WHEN EXPOSED TO HIGH TEMPERATURES FROM A HEAT GUN.

HIGH-TEMPERATURE RESISTANCE: DESIGNED TO WITHSTAND THE RIGOROUS THERMAL DEMANDS OF MODERN LEAD-FREE REBALLING WITHOUT LOSING ITS STRUCTURAL INTEGRITY.

PRECISION ALIGNMENT: THE HOLE LAYOUT IS CNC-MILLED TO PERFECTLY MATCH THE DENSE BALL GRID ARRAY (BGA) OF THE SM8750, ENSURING NO BRIDGING OR COLD SOLDER JOINTS.

POLISHED FINISH: THE STENCIL SURFACE AND HOLES ARE SPECIALLY TREATED TO ALLOW FOR EASY RELEASE OF SOLDER PASTE, REDUCING CLEANUP TIME AND INCREASING SUCCESS RATES.

Technical Specifications:

  • Material: Stainless Steel

  • Pattern: Square

  • Dimensions (W x H): 10 x 8 cm

  • Thickness: 0.12mm

  • Color: Silver

  • Item Weight: 50 g

  • Country of Origin: China

  • Net Quantity: 1

  • Reusable: Yes

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

logo

We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

User Reviews

0.0 out of 5
0
0
0
0
0
Write a review

There are no reviews yet.

Be the first to review “SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus”

Your email address will not be published. Required fields are marked *

SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus
SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus

300.00

YOUR CART
  • No products in the cart.
mobilestencil
Logo
Compare items
  • Total (0)
Compare
0
SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus
SAM21 SM8750 CPU BGA Reballing Stencil for Samsung S25 S25 Plus
- +
300.00
0
Shopping cart