S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
₹350.00
AMAOE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S25 S25+ S936 S931-012

S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012

AMAOE MIDDLE LAYER BGA REBALLING STENCIL FOR SAMSUNG S25 S25+ S936 S931-012
S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
HIGHLIGHTS
FOR SAMSUNG S25 S25+ MIDDLE LAYER STENCIL
BRAND AMAOE
MODEL AMAOE FOR S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
ITEM MODEL SUPPORTING IC CPU RAM PA NUMBER
S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
S931 S25 S25+
SQUARE PATTERN
STAINLESS STEEL MATERIAL
SIZE:70*7OMM T:0. 12MM
COLOR: SILVER
SPECIFICATIONS
IN THE BOX
NUMBER OF CONTENTS IN SALES PACKAGE
PACK OF 1
COUNTRY OF ORIGIN CHINA
GENERAL
PATTERN SQUARE
MATERIAL STAINLESS STEEL
SUITABLE FOR POSSIBLE VALUE
RE-USABLE YES
NET QUANTITY 1
DIMENSIONS
SIZE:70*7OMM T:0. 12MM
ITEM WEIGHT 50 G
shipping & delivery
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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
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S25 S931 Middle Layer BGA Reballing Stencil for S25+ S936 S931-012
₹350.00









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