QSU1 STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

AMAOE U-OSU1 – SUPPORTED ICS, CPU

Snapdragon 835-MSM8998

MSM8274

MSM8674

MSM8974

Snapdragon 650-MSM8956

Snapdragon 652-MSM8976

Snapdragon 820-MSM8996

MSM8998RAM

Snapdragon 808-MSM8992

RAM256

RAM366 Heat dissipation hole anti-bulging design

Qualcomm – CPU Collection Network – 0.12MM

U-QSU1 0.12MM

300.00

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QSU1 BGA REBALLING STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

 

QSU1 BGA REBALLING STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

QSU1 BGA REBALLING STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

AMAOE U-OSU1 – SUPPORTED ICS, CPU

Snapdragon 835-MSM8998

MSM8274

MSM8674

MSM8974

Snapdragon 650-MSM8956

Snapdragon 652-MSM8976

Snapdragon 820-MSM8996

MSM8998RAM

Snapdragon 808-MSM8992

RAM256

RAM366 Heat dissipation hole anti-bulging design

Qualcomm – CPU Collection Network – 0.12MM

U-QSU1 0.12MM

AMAOE U-QSU1 Qualcomm CPU BGA Reballing Stencil (0.12mm Thickness)

Product Description

Professional-grade BGA Reballing Stencil designed by AMAOE, the industry leader in mobile repair tooling. This U-QSU1 (Qualcomm Series 1) stencil is engineered for high-precision alignment and durability, specifically tailored for a wide range of Snapdragon processors and dedicated RAM modules.

Featuring a specialized anti-bulging design, the stencil includes integrated heat dissipation holes (RAM366) to ensure a flat, uniform solder paste application even under thermal stress.

Key Features

  • Precision Thickness: 0.12mm high-quality stainless steel for perfect solder ball consistency.

  • Heat Dissipation Design: Special RAM366 anti-bulging technology prevents the stencil from warping during the heating process.

  • Durable Material: Highly flexible yet robust steel ensures a long service life and resistance to deformation.

  • Qualcomm CPU Series 1 Collection: Specifically optimized for early and mid-generation Snapdragon processors and their corresponding RAM layers.

Supported Chipsets & ICs

Type Model / Chipset
Snapdragon 800 Series MSM8998 (Snapdragon 835), MSM8996 (Snapdragon 820), MSM8992 (Snapdragon 808)
Snapdragon 600 Series MSM8956 (Snapdragon 650), MSM8976 (Snapdragon 652)
Legacy Snapdragon MSM8274, MSM8674, MSM8974
RAM Support MSM8998 RAM, RAM256, RAM366

Technical Specifications

  • Brand: AMAOE

  • Model: U-QSU1 (Universal Qualcomm Series 1)

  • Stencil Thickness: 0.12MM

  • Design Feature: RAM366 Heat Dissipation Hole (Anti-Bulging)


Suggested Product Categories & Tags

  • Categories: Mobile Repair Tools, BGA Reballing Stencils, Qualcomm IC Repair

  • Tags: AMAOE, Snapdragon 835, BGA Stencil, MSM8998, 0.12mm Stencil, Mobile IC Repair Tools

Technical Specifications:

  • Material: Stainless Steel

  • Pattern: Square

  • Dimensions (W x H): 10 x 8 cm

  • Thickness: 0.12mm

  • Color: Silver

  • Item Weight: 50 g

  • Country of Origin: China

  • Net Quantity: 1

  • Reusable: Yes


shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

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We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

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QSU1 STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976
QSU1 STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

300.00

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