QSU1 STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976
AMAOE U-OSU1 – SUPPORTED ICS, CPU
Snapdragon 835-MSM8998
MSM8274
MSM8674
MSM8974
Snapdragon 650-MSM8956
Snapdragon 652-MSM8976
Snapdragon 820-MSM8996
MSM8998RAM
Snapdragon 808-MSM8992
RAM256
RAM366 Heat dissipation hole anti-bulging design
Qualcomm – CPU Collection Network – 0.12MM
U-QSU1 0.12MM
₹300.00
QSU1 BGA REBALLING STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976

QSU1 BGA REBALLING STENCIL FOR MSM8998 MSM8274 MSM8674 MSM8974 MSM8956 MSM8976
AMAOE U-OSU1 – SUPPORTED ICS, CPU
Snapdragon 835-MSM8998
MSM8274
MSM8674
MSM8974
Snapdragon 650-MSM8956
Snapdragon 652-MSM8976
Snapdragon 820-MSM8996
MSM8998RAM
Snapdragon 808-MSM8992
RAM256
RAM366 Heat dissipation hole anti-bulging design
Qualcomm – CPU Collection Network – 0.12MM
U-QSU1 0.12MM
AMAOE U-QSU1 Qualcomm CPU BGA Reballing Stencil (0.12mm Thickness)
Product Description
Professional-grade BGA Reballing Stencil designed by AMAOE, the industry leader in mobile repair tooling. This U-QSU1 (Qualcomm Series 1) stencil is engineered for high-precision alignment and durability, specifically tailored for a wide range of Snapdragon processors and dedicated RAM modules.
Featuring a specialized anti-bulging design, the stencil includes integrated heat dissipation holes (RAM366) to ensure a flat, uniform solder paste application even under thermal stress.
Key Features
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Precision Thickness: 0.12mm high-quality stainless steel for perfect solder ball consistency.
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Heat Dissipation Design: Special RAM366 anti-bulging technology prevents the stencil from warping during the heating process.
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Durable Material: Highly flexible yet robust steel ensures a long service life and resistance to deformation.
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Qualcomm CPU Series 1 Collection: Specifically optimized for early and mid-generation Snapdragon processors and their corresponding RAM layers.
Supported Chipsets & ICs
Technical Specifications
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Brand: AMAOE
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Model: U-QSU1 (Universal Qualcomm Series 1)
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Stencil Thickness: 0.12MM
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Design Feature: RAM366 Heat Dissipation Hole (Anti-Bulging)
Suggested Product Categories & Tags
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Categories: Mobile Repair Tools, BGA Reballing Stencils, Qualcomm IC Repair
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Tags: AMAOE, Snapdragon 835, BGA Stencil, MSM8998, 0.12mm Stencil, Mobile IC Repair Tools
Technical Specifications:
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Material: Stainless Steel
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Pattern: Square
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Dimensions (W x H): 10 x 8 cm
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Thickness: 0.12mm
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Color: Silver
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Item Weight: 50 g
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Country of Origin: China
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Net Quantity: 1
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Reusable: Yes
shipping & delivery
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RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME
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₹300.00







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