IPBB2 Stencil IP7-16 CPU / NAND / WiFi / NFC IC STENCIL

IPBB2 Stencil IP7-16 CPU / NAND / WiFi / NFC IC STENCIL

IPBB:2 Qualcomm version

8-X Qualcomm baseband

XR/XS baseband

11 baseband

12 baseband

13 baseband

14/15/16 baseband

7/8/X baseband

A10 CPU

A18 CPU

A16 CPU

A14 CPU

A12 CPU

A11 CPU

A18Pro CPU

A17 CPU

A15 CPU

A13 CPU

BGA315

11 WIFI

12/ 13/14 WIFI

XS WIFI

BGA70

BGA110

7/7P  NFC

8/8P/X NFC

 XR/XS NFC

11-13 NFC

14 NFC

16 NFC

15USB 

15 WIFI

16WIFT

7/ 8/ X/ XR WIFI

IP7-16 board transfer net – 0.12MM

Detailed Component Support Matrix

IPBB2 Stencil – IP7–16 CPU / NAND / WiFi / NFC IC Stencil (Qualcomm Version, 0.12MM)

IPBB2 (Qualcomm Version) is a professional-grade 0.12MM board transfer mesh designed for advanced iPhone motherboard repair from iPhone 7 through iPhone 16.

This stencil supports CPU, Baseband, NAND, WiFi, NFC, and USB IC reballing, making it an all-in-one solution for microsoldering technicians and repair labs.

Precision laser-etched from high-quality stainless steel, it ensures accurate alignment, clean solder ball formation, and reliable high-temperature performance.

✅ Supported Baseband IC (Qualcomm Version)

• iPhone 7 / 8 / X Baseband

• iPhone 8–X Qualcomm Baseband

• iPhone XR / XS Baseband

• iPhone 11 Baseband

• iPhone 12 Baseband

• iPhone 13 Baseband

• iPhone 14 / 15 / 16 Baseband

✅ Supported CPU Stencil

Compatible with Apple A-Series processors:

• Apple A10

• Apple A11

• Apple A12

• Apple A13

• Apple A14

• Apple A15

• Apple A16

• Apple A17

• Apple A18

• Apple A18 Pro

✅ Supported NAND (Flash Storage)

• BGA70

• BGA110

• BGA315

Suitable for NAND reballing, upgrade, and data recovery operations.

✅ Supported WiFi IC

• iPhone 7 / 8 / X / XR WiFi

• iPhone XS WiFi

• iPhone 11 WiFi

• iPhone 12 / 13 / 14 WiFi

• iPhone 15 WiFi

• iPhone 16 WiFi

✅ Supported NFC IC

• iPhone 7 / 7 Plus NFC

• iPhone 8 / 8 Plus / X NFC

• iPhone XR / XS NFC

• iPhone 11–13 NFC

• iPhone 14 NFC

• iPhone 16 NFC

✅ Other Supported IC

• iPhone 15 USB IC

🔧 Product Specifications

• Model: IPBB2 (Qualcomm Version)

• Thickness: 0.12MM

• Material: Heat-resistant stainless steel

• Process: High-precision laser etching

• Application: CPU / Baseband / NAND / WiFi / NFC reballing

• Type: IP7–16 Board Transfer Net

🎯 Ideal For

• Professional microsoldering technicians

• Advanced motherboard repair shops

• NAND upgrade & data recovery services

• Baseband signal repair

• WiFi / NFC fault repair

IPBB2 IP7–16 Stencil delivers precise alignment, uniform solder distribution, and improved repair success rates — an essential tool for high-level iPhone logic board repair.

Technical Specifications:

• Material: Stainless Steel

• Pattern: Square

• Dimensions (W x H): 10 x 8 cm

• Thickness: 0.12mm

• Color: Silver

• Item Weight: 50 g

• Country of Origin: China

• Net Quantity: 1

• Reusable: Yes