AMAOE ZF9 Reballing Stencil for Asus ZenFone 9

AMAOE ZF9 Reballing Stencil for Asus ZenFone 9

AMAOE Reballing Stencil for Asus ZenFone 9

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Asus ZenFone 9. This tool is engineered to work specifically on the phone’s middle layer motherboard, which is a key part of its compact, space-saving design. This stencil is essential for technicians performing component-level repairs on this flagship device.

• Dedicated to Asus ZenFone 9 (中层): This stencil is a precision tool designed for the main ICs located in the middle layer of the ZenFone 9’s motherboard. The phone uses the Qualcomm Snapdragon 8+ Gen 1 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
• Ultra-Precision 0.08mm Thickness: This is a crucial feature that sets this stencil apart. At just 0.08mm, it is significantly thinner than standard stencils and is specifically designed for the ultra-fine-pitch solder pads found on the most advanced chipsets. This ensures the correct amount of solder paste is applied, preventing shorts and creating a perfect solder joint.
• Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool.
  • Material: Stainless Steel
  • Pattern: Square
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes