AMAOE XF-012 Reballing Stencil for Vivo X Flip

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Vivo X Flip foldable phone. The tool is engineered to work specifically on the phone’s middle layer motherboard, a crucial part of its complex, space-saving design. This stencil is essential for technicians performing component-level repairs on foldable devices.

Dedicated to Vivo X Flip (中层): This stencil is a precision tool designed for the main ICs located in the middle layer of the Vivo X Flip’s motherboard. The phone uses the Qualcomm Snapdragon 8+ Gen 1 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made with the repair professional in mind.
Optimal Dimensions: The stencil’s size of 70x70mm is specifically tailored to fit the dimensions of the Vivo X Flip’s motherboard, ensuring full coverage for the chips in the middle layer.
- Material: Stainless Steel
- Pattern: Square
- Thickness: 0.12mm
- Color: Silver
- Item Weight: 50 g
- Country of Origin: China
- Net Quantity: 1
- Reusable: Yes