AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection)

Name: AMAOE U-MTU5 BGA Reballing Stencil (Modern MediaTek Dimensity CPU Collection) - mobilestencil
Price: 300.00 INR
Availability: InStock

Product Overview

The AMAOE Stencil-U-MTU5 (U-MTU5) is a state-of-the-art, multi-chip BGA (Ball Grid Array) reballing stencilfrom the patented UBGA – Solder Reinstallation Expert Series. This stencil is specifically developed for professional technicians working on recent and flagship MediaTek Dimensity SoCs (System-on-Chips). It is designed to handle the dense and complex pin layouts of these modern processors, ensuring high-accuracy reballing for complex repair work.

Key Features and Specifications

Model: Stencil-U-MTU5 / U-MTU5
Brand: AMAOE Easy Repair®
Application: BGA Rework/Reballing for a collection of modern MediaTek Dimensity CPUs and RAM chips.
Thickness: 0.12MM—The standard thinness necessary for precise, small-pitch solder ball formation on modern ICs.
Material: High-quality steel mesh/stencil.
Patented Design: ZL2016213989365
Innovation: Features Anti-bulging design with heat dissipation vents—This critical engineering prevents warping and deformation of the stencil when high heat is applied during the reballing process, which is essential for successfully working with large, delicate flagship chips.
Slogan: Tools made with the repairman’s experience in mind / making soldering easier!

Compatible MediaTek (MTK) Chips and RAM

This stencil is a crucial tool for repairing the latest generation of mid-range to flagship MediaTek SoCs:

Chip Model	MediaTek Family Name	Typical Use
Dimensity 9400 (MT6991Z)	Flagship Series	High-end/Flagship Smartphones (e.g., Xiaomi, Vivo, OPPO)
Dimensity 9300 (MT6989W)	Flagship Series	High-end/Flagship Smartphones
Dimensity 9200 (MT6985W)	Flagship Series	High-end/Flagship Smartphones
Dimensity 8300 Ultra(MT6897Z)	High-End Series	Performance-focused Mid-to-High-End Smartphones
Dimensity 7300X(MT6878V)	Mid-Range Series	Mid-Range Smartphones/Foldables
Dimensity 7200 Ultra(MT6886V)	Mid-Range Series	Mid-Range Smartphones
Dimensity 6100+ (MT6835V)	Entry-Level 5G Series	Budget 5G Smartphones
RAM496	RAM Package	A standard pattern for 496-ball BGA RAM chips common in these devices.

This stencil is an indispensable tool for advanced mobile technicians focused on repairing current-generation, high-value Android flagship and high-end devices.

Dimensity CPU Supporting Mobile Models (Examples)

Chip Model (Series)	MediaTek Family Name	Brands and Models (Examples)	Typical Release Year
Dimensity 9400(MT6991Z)	Flagship	Vivo X Series, OPPO Find X Series, Xiaomi Flagship Models (e.g., Xiaomi 15 Series).	Expected Late 2024 / 2025
Dimensity 9300(MT6989W)	Flagship	Vivo X100 Pro, OPPO Find X7, Vivo Pad 3 (some versions).	Late 2023 / 2024
Dimensity 9200(MT6985W)	Flagship	Vivo X90 / X90 Pro, OPPO Find N2 Flip, Redmi K60 Ultra.	Late 2022 / 2023
Dimensity 8300 Ultra (MT6897Z)	High-End	Xiaomi Poco X6 Pro, Xiaomi Redmi K70E.	Late 2023 / 2024
Dimensity 7200 Ultra (MT6886V)	Mid-Range	Xiaomi Redmi Note 13 Pro+ 5G, Vivo V27 Pro.	2023 / 2024
Dimensity 7300X(MT6878V)	Mid-Range/Foldable	Mid-range smartphones and likely used in flexible/folding devices.	Expected 2024
Dimensity 6100+(MT6835V)	Budget 5G	Samsung Galaxy A15 5G, Realme 11x 5G, Xiaomi Redmi 12 5G.	2023 / 2024
RAM496	RAM Package	This is the standard BGA pattern for the 496-ball RAM chips used in conjunction with these modern, large SoC