AMAOE Stencil MACBOOK CD3217 4in1 0.12mm

AMAOE Stencil MACBOOK CD3217 4in1 0.12mm

AMAOE Stencil – MacBook CD3217 4in1 (0.12mm)

AMAOE MacBook CD3217 4in1 Stencil (0.12mm) is a professional reballing steel mesh designed specifically for repairing the CD3217 USB-C power management IC used on MacBook logic boards.

Engineered with high-precision laser cutting and durable stainless steel, this stencil ensures accurate alignment and clean solder ball formation during reballing and chip replacement.

✅ Compatible IC

• CD3217 USB-C Power Delivery Controller

Commonly found on various Apple MacBook models with USB-C charging ports.

🔧 Product Features

• 4-in-1 design – Multiple layout options in one stencil

• Thickness: 0.12mm

• High-precision laser etched holes

• Accurate pad positioning

• Heat-resistant stainless steel

• Smooth tin planting, easy release

🎯 Ideal For

• MacBook USB-C charging repair

• CD3217 chip reballing

• Short circuit & power failure repair

• Professional motherboard microsoldering

This AMAOE CD3217 4in1 Stencil improves reballing efficiency and precision, making it an essential tool for MacBook USB-C power IC repair technicians.

AMAOE CD3217 4-in-1 MacBook USB-C Controller Reballing Stencil

SEO Product Title

AMAOE MacBook CD3217 4-in-1 Stencil – USB-C Power Delivery IC Reballing (0.12mm)

Short Product Description (Meta)

High-precision 0.12mm AMAOE stencil for MacBook USB-C repair. Supports CD3217, CD3215, and CD3218 Power Delivery ICs. Essential for fixing MacBook “No Power” or “5V USB-C” issues. Durable Japanese steel with CNC square holes.

Detailed Specifications

Key Features for mobileic.in

• 4-in-1 Multi-Pattern: This single plate covers the most frequently replaced USB-C controller chips used across the MacBook Pro and Air lineup (Intel & M1/M2/M3 eras).

• Fixes “5V Stuck” Issues: The CD3217/CD3215 ICs are the primary cause of a MacBook stuck at 5V on the USB-C meter instead of boosting to 20V. This stencil allows for perfect reballing of these sensitive chips.

• Anti-Warping Technology: Specifically designed to remain flat under the high-heat cycles required to remove and replace these underfilled ICs.

• Precision Alignment: Square holes ensure that solder balls are perfectly centered, preventing shorts between the high-density pads of the Power Delivery (PD) controllers.

Technician’s Repair Tip

When working with CD3217/15 ICs, these chips often have tough factory underfill. After cleaning the chip, use this stencil with 183°C leaded solder paste. Because these chips handle power delivery, a strong mechanical connection is vital to prevent future failures from thermal expansion.

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