AMAOE Reballing Stencil for ASUS ROG6

AMAOE Reballing Stencil for ASUS ROG Phone 6 Dimensity Edition

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the ASUS ROG Phone 6 Dimensity Edition. This tool is engineered to work specifically on the phone’s middle layer motherboard, which is a key part of its complex, heat-dissipating design. This stencil is essential for technicians performing component-level repairs on this high-performance gaming device.

Dedicated to ROG Phone 6 (天玑版): This stencil is a precision tool designed for the main ICs located in the middle layer of the ROG Phone 6. The “Dimensity Edition” of this phone uses the MediaTek Dimensity 9000+chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
Ultra-Precision 0.08mm Thickness: This is a crucial feature that sets this stencil apart. At just 0.08mm, it is significantly thinner than standard stencils and is specifically designed for the ultra-fine-pitch solder pads found on the most advanced chipsets. This ensures the correct amount of solder paste is applied, preventing shorts and creating a perfect solder joint.
Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made with the repair professional in mind.