AMAOE QU8 STENCIL SM8250 SM8350 Reballing Stencil for Qualcomm CPUs

AMAOE QU8 STENCIL SM8250 SM8350 Reballing Stencil for Qualcomm CPUs

AMAOE QU8 Universal Reballing Stencil for Qualcomm CPUs

This is a professional-grade universal reballing stencil from AMAOE’s “Superhard Series.” The QU8 is a versatile tool designed for the advanced repair of a wide range of mobile devices, covering a spectrum of Qualcomm processors from older mid-range chips to modern flagships.

Key Features

• Advanced Half-Etching Design: This stencil features a patented half-etching and full-etching design. The half-etched areas create shallow depressions that block excess solder, which is crucial for preventing solder bridges on delicate and fine-pitch BGA pads.
• “Superhard Series” Durability: Made from a rigid, high-strength steel, this stencil is built to withstand repeated use without warping, ensuring consistent and reliable results.
• Anti-Bulging Heat Dissipation Vents: The stencil includes special vents to prevent it from bulging or lifting during the heating process. This guarantees that the stencil remains perfectly flat against the chip, which is vital for precise solder paste application.
• Optimal 0.12mm Thickness: With a precision thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads, which is essential for preventing shorts and creating a robust connection.

Compatible Chipsets

This universal stencil supports a variety of popular Qualcomm chipsets and their respective RAM modules:

• SM8350 (Snapdragon 888): Used in flagship phones like the Samsung Galaxy S21 series and Xiaomi Mi 11. The stencil also includes a pattern for its associated RAM.
• SM8250 (Snapdragon 865): The stencil supports two variants of this chip, the SM8250-102 and SM8250-002, along with their corresponding RAM. This is a powerful flagship processor found in many 2020-2021 phones.
• SDM439: A less common, older, entry-level processor that can be found in a variety of low-to-mid-range smartphones.

SM8350 (Snapdragon 888)

This is a flagship processor widely used in 2021 and 2022 high-end phones.

• Samsung: Galaxy S21 FE, Galaxy Z Flip 3, Galaxy Z Fold 3
• Xiaomi: Mi 11X Pro, Xiaomi 11T Pro
• OnePlus: OnePlus 9, OnePlus 9 Pro
• Realme: Realme GT 5G, Realme GT 2
• ASUS: Zenfone 8, ROG Phone 5

SM8250 (Snapdragon 865)

This flagship processor was a staple in 2020 and 2021 premium devices.

• Samsung: Galaxy S20 series (in US and China variants)
• OnePlus: OnePlus 8, OnePlus 8 Pro, OnePlus 8T
• Xiaomi: Mi 10, Mi 10T Pro
• Sony: Xperia 1 II, Xperia 5 II
• Oppo: Find X2, Find X2 Pro

SDM439 (Snapdragon 439)

This is an entry-level to mid-range processor used in budget-friendly smartphones.

• Xiaomi: Redmi 8, Redmi 8A Dual, Redmi 7A
• Samsung: Galaxy M01, Galaxy A01
• Nokia: Nokia 4.2
• Vivo: Vivo Y11 (2019), Vivo Y95

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes