AMAOE MZ20P-012 Reballing Stencil for Meizu 20 Pro

This is a professional-grade reballing stencil from AMAOE, designed for the advanced repair of the Meizu 20 Prosmartphone. The tool is engineered to work specifically on the phone’s middle layer motherboard, which is a key part of its complex, space-saving design. This stencil is an essential tool for technicians performing component-level repairs on this flagship device.

• Dedicated to Meizu 20 Pro (中层): This stencil is a precision tool designed for the main ICs located in the middle layer of the Meizu 20 Pro’s motherboard. The phone uses the Qualcomm Snapdragon 8 Gen 2 chipset, and a dedicated stencil is crucial for a successful reballing of its high-density BGA package.
• Strong Magnetic Properties (强磁性): The stencil’s powerful magnetic property allows it to securely and quickly snap into place on a magnetic reballing platform. This is a critical feature that prevents misalignment and ensures accuracy when dealing with thousands of microscopic solder pads.
• Optimal 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made with the repair professional in mind.