AMAOE MU1 Stencil MTK CPU MT6750 MT6795 MT6595 MT6797 CPU STENCIL
AMAOE MU:1– SUPPORTED ICS, CPU
MT6795W
MT6797W
MT6595
MT6732
MT6750
₹300.00
AMAOE MU1 Stencil MTK CPU MT6750 MT6795 MT6595 MT6797 CPU STENCIL

AMAOE MU1 Stencil MTK CPU MT6750 MT6795 MT6595 MT6797 CPU STENCIL
Product Description List
Key Features
Model Name: AMAOE MU-1 (or MU1)
Category: MTK CPU Universal Reballing Stencil
Purpose: Used for applying solder paste/balls to the BGA (Ball Grid Array) pads of the IC during the reballing process (chip-level repair).
Thickness: 0.12mm (Ultra-thin to ensure precise solder ball formation).
Material: High-quality, durable stainless steel.
Design: Precision laser-cut with square round holes for clean and accurate alignment.
Supported MediaTek (MTK) CPUs
The AMAOE MU1 stencil is compatible with a range of MediaTek MT-series CPU chips. Based on product listings, the supported ICs typically include:
MT6795W
MT6797W
MT6595
MT6732
MT6750
CPUs you listed:
Notable Devices that Used These Chipsets
Since a complete “support list” is nearly impossible to compile for older chips, here are some of the most notable or popular smartphones that featured these processors, which gives you an idea of their market placement:
MT6795W (Helio X10)
This was a very popular chip in the mid-2010s, powering many upper-midrange to “flagship killer” devices.
- Xiaomi Redmi Note 2/3
- HTC One E9+/M9+
- Meizu MX5
- LeEco Le 1s
MT6797W (Helio X20)
The Helio X20 was famous for its deca-core (10-core) tri-cluster design, aiming for performance and efficiency.
- Meizu MX6 / Pro 6
- Xiaomi Redmi Note 4 (MediaTek version)
- LeEco Le 2
- Vernee Apollo Lite
MT6595
An older 32-bit SoC that was powerful for its time, using the big.LITTLE structure with Cortex-A17 cores.
- Meizu MX4
- Lenovo Vibe X2
MT6732
A 64-bit quad-core chip for the mass-market transition to LTE and 64-bit Android.
- Sony Xperia E4g
- Acer Liquid Jade Z
MT6750
A power-efficient octa-core chip used in many entry-to-mid-range devices for several years.
- Oppo A57 / A37
- LG X Power 2
- Various devices from Huawei, Lenovo, and other regional brands.
These chips are mostly found in devices released between 2014 and 2017. If you are looking for information regarding a specific device with one of these CPUs, searching for the phone’s model number along with the CPU might yield more targeted results.
Technical Specifications:
- Material: Stainless Steel
- Pattern: Square
- Dimensions (W x H): 10 x 8 cm
- Thickness: 0.12mm
- Color: Silver
- Item Weight: 50 g
- Country of Origin: China
- Net Quantity: 1
- Reusable: Yes
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