AMAOE MQ4 STENCIL CPU SM8450 SM8350 SM7325 Reballing Stencil

AMAOE MQ4 STENCIL CPU SM8450 SM8350 SM7325 Reballing Stencil

AMAOE MQ4 Universal Reballing Stencil

This is a professional-grade universal reballing stencil from AMAOE’s “Superhard Series,” designed for a wide range of popular Qualcomm and MediaTek CPUs and their associated components. This versatile stencil is an essential tool for any repair professional performing board-level work on a variety of modern smartphones.

Key Features and Compatibility

• Superhard Series Design: Made from a durable, high-strength steel, this stencil is built to withstand repeated use without warping. Its rigidity ensures precise alignment and uniform solder paste application.
• Anti-Bulging Heat Dissipation Vents: The stencil’s unique design includes strategically placed vents. These prevent air pressure from building up under the stencil during heating, which eliminates bulging and guarantees perfectly formed solder balls, preventing short circuits.
• Optimal 0.12mm Thickness: The stencil has a thickness of 0.12mm, the industry standard for reballing modern, fine-pitch BGA chips. This ensures the correct amount of solder is applied to each pad for a strong, reliable connection.

Supported Chipsets

This universal stencil provides patterns for a comprehensive list of chips, allowing a single tool to handle repairs on many different devices.

• Qualcomm Snapdragon Processors:
  • Snapdragon 8 Gen 1 (SM8450)
  • Snapdragon 888 (SM8350)
  • Snapdragon 778G (SM7315/SM7325)
• MediaTek Dimensity Processors:
  • Dimensity 810 (MT6833V)
  • Dimensity 900 (MT6877V)
• Other MediaTek Components:
  • MT6799W CPU and its dedicated RAM
  • Patterns for SM8350/8450 RAM, allowing you to reball the memory chips alongside their respective CPUs.

• Technical Specifications:

   

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

Qualcomm Processors

• SM8350 (Snapdragon 888)
  • Samsung: Galaxy S21 FE 5G, Galaxy Z Flip 3
  • Xiaomi: Mi 11X Pro, Xiaomi 11T Pro
  • OnePlus: OnePlus 9, OnePlus 9 Pro
  • ASUS: Zenfone 8, ROG Phone 5
  • Realme: GT 2
• SM8450 (Snapdragon 8 Gen 1)
  • Samsung: Galaxy S22 series (S22, S22 Plus)
  • OnePlus: OnePlus 10 Pro
  • Xiaomi: Xiaomi 12 Pro
  • Vivo: Vivo X80 Pro
  • Motorola: Edge 30 Pro
• SM7315 / SM7325 (Snapdragon 778G / 778G+)
  • Samsung: Galaxy A52s 5G, Galaxy M52 5G
  • Xiaomi: Xiaomi 11 Lite NE, POCO X5 Pro 5G
  • Honor: Honor 50
  • Realme: Realme GT Master Edition
  • Vivo: Vivo V29 5G

MediaTek Processors

• MT6833V (Dimensity 810)
  • Xiaomi: Redmi Note 11T 5G
  • POCO: POCO M4 Pro 5G
  • Realme: Realme 8s 5G, Realme 9i 5G
  • Infinix: Infinix Hot 20 5G
• MT6799W (Helio X30)
  • This is an older, high-end chip from the Helio series.
  • Meizu: Meizu Pro 7 Plus
  • Vernee: Vernee Apollo 2
• MT6877V (Dimensity 900)
  • OnePlus: OnePlus Nord CE 2 5G
  • Samsung: Galaxy M53 5G
  • Vivo: Vivo V25 5G
  • OPPO: OPPO Reno7 5G