AMAOE MQ3 STENCIL SM7250 SM8250 SM7150 CPU Reballing Stencil

AMAOE MQ3 STENCIL SM7250 SM8250 SM7150 CPU Reballing Stencil

AMAOE MQ3 Universal Reballing Stencil

This is a professional-grade universal reballing stencil from AMAOE’s “Superhard Series.” The MQ3 is a versatile tool designed for the advanced repair of a wide range of mobile devices, covering a spectrum of Qualcomm and MediaTek processors. This stencil is a core tool for any repair professional performing board-level work on a variety of modern smartphones.

Key Features

• “Superhard Series” Durability: Made from a rigid, high-strength steel, this stencil is built to withstand repeated use without warping, ensuring consistent and reliable results.
• Anti-Bulging Heat Dissipation Vents: The stencil includes specialized vents to prevent it from bulging or lifting during the heating process. This guarantees that the stencil remains perfectly flat against the chip, which is vital for precise solder paste application and preventing shorts.
• Optimal 0.12mm Thickness: With a precision thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s pads, which is essential for creating a robust connection.

Compatible Chipsets

This universal stencil provides patterns for a comprehensive list of chips, allowing a single tool to handle repairs on many different devices.

• Qualcomm Snapdragon Processors:
  • Snapdragon 865 (SM8250): A flagship processor widely used in 2020 and 2021 devices. The stencil also includes a pattern for its associated RAM.
  • Snapdragon 765 (SM7250): A popular mid-range chip with integrated 5G connectivity.
  • Snapdragon 730 (SM7150): A powerful mid-range processor known for its AI capabilities.
  • Snapdragon 665 (SM6125): An entry-level processor for budget-friendly smartphones.
• MediaTek Processor:
  • Dimensity 820 (MT6885Z): A high-performance processor known for its use in devices like the Redmi 10X 5G. The stencil supports both the CPU and its associated RAM.

Qualcomm SM8250 (Snapdragon 865)

This is a high-end flagship processor.

• Samsung: Galaxy S20, Galaxy S20+, Galaxy S20 Ultra, Galaxy S20 FE 5G (international versions)
• OnePlus: OnePlus 8, OnePlus 8 Pro, OnePlus 8T
• Xiaomi: Xiaomi Mi 10, Mi 10 Pro, Mi 10T, Mi 10T Pro
• Google: Google Pixel 5
• Sony: Xperia 1 II, Xperia 5 II
• ASUS: ROG Phone 3, ZenFone 7

MediaTek MT6885Z (Dimensity 820)

This is a powerful mid-range processor, commonly found in devices for the Chinese market.

• Xiaomi: Redmi 10X 5G, Redmi 10X Pro 5G
• Vivo: Vivo S7t 5G

Qualcomm SM7250 (Snapdragon 765/765G)

This is a popular mid-range processor with integrated 5G connectivity.

• Google: Google Pixel 4a 5G, Google Pixel 5
• LG: LG Velvet
• OnePlus: OnePlus Nord
• OPPO: OPPO Find X2 Neo, OPPO Reno4 5G, OPPO Reno3 Pro 5G

Qualcomm SM7150 (Snapdragon 730/730G)

This is a mid-range gaming-focused processor.

• Xiaomi: Xiaomi Mi Note 10, Xiaomi Mi 9T/Redmi K20
• Samsung: Samsung Galaxy A80, Galaxy A71
• Google: Google Pixel 4a
• Realme: Realme X2

Qualcomm SM6125 (Snapdragon 665)

This is a widely used entry-level to mid-range processor known for efficiency.

• Xiaomi: Xiaomi Mi A3, Redmi Note 8, Redmi Note 8T
• Realme: Realme 5, Realme 5s, Realme 5i
• Oppo: OPPO A9 2020, OPPO A52
• Motorola: Motorola Moto G8 Plus, Moto G Power (2020)

Technical Specifications:

• Material: Stainless Steel
• Pattern: Square
• Dimensions (W x H): 10 x 8 cm
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 50 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes