AMAOE MQ2 BGA Reballing Stencil (0.12mm) – Qualcomm/MTK CPU & IC

AMAOE MQ2 BGA Reballing Stencil (0.12mm) - Qualcomm/MTK CPU & IC

Feature	Specification/Detail
Product Type	BGA Reballing Stencil (Planting Tin Net)
Model	MQ2 (Part of the MQ series)
Thickness	0.12mm (Ultra-thin for precise solder paste application)
Material	High-Quality Stainless Steel
Application	Reballing and Rework of BGA components (CPUs/ICs)
Compatibility	Multi-Model support for various Qualcomm and MTK chips

urpose and Function

The MQ2 stencil is used to facilitate the process of reballing, which is necessary when a Ball Grid Array (BGA) chip, such as a CPU or Power IC, needs to be removed from a device’s motherboard and then reinstalled.

Solder Ball Placement: The stencil features a precise pattern of apertures (holes) that perfectly align with the solder pads on the removed chip.

Solder Paste Application: The technician applies solder paste over the stencil, which fills the tiny holes.

Heating and Formation: When heated, the paste melts, forming perfectly sized and aligned solder balls, which are critical for establishing reliable electrical connections when the chip is soldered back onto the PCB (Printed Circuit Board).

Supported Chip Models (Examples)

The MQ2 stencil is a dedicated multi-chip design supporting a variety of mid-to-entry-level chipsets. Known supported models include:

MediaTek (MTK) CPUs/ICs:

MT6761V (Helio A22 series)

MT6765V (Helio P35 series)

MT6768V (Helio P65 series)

MT6779V (Helio P90 series)

MT6758V (Helio P30 series)

Qualcomm CPUs/ICs:

MSM8909W (CPU and RAM layouts)

SDM439 (Snapdragon 439)

Qualcomm Chipsets

Chipset Name	Type	Key Details	Example Supporting Models
MSM8909W CPU	Mobile/Wearable SoC (Snapdragon Wear 2100)	Low-power processor often used in smartwatches and basic IoT devices. It’s a variant of the Snapdragon 210 family.	Light Phone 2, Mobvoi Ticwatch Pro (APQ8009W variant)
MSM8909W RAM	Mobile/Wearable SoC	This refers to the same chipset family as the CPU (Snapdragon Wear 2100), which includes the RAM controller as part of the chip.	Light Phone 2, Mobvoi Ticwatch Pro (APQ8009W variant)
SDM439	Mobile SoC (Snapdragon 439)	Entry-level processor, often used in budget smartphones.	Xiaomi Redmi 8, Xiaomi Redmi 7A, vivo Y11 (2019), Nokia 4.2, Samsung Galaxy A01

MediaTek Chipsets

Chipset Name	Type	Key Details	Example Supporting Models
MT6761V	Mobile SoC (Helio A22)	Entry-level processor for budget smartphones.	Huawei (various models, often lower-end), Lava Z62 (Helio A22 is the common name)
MT6779V	Mobile SoC (Helio G90/G90T)	Mid-range processor focused on gaming performance for its time.	The search results didn’t directly list devices for the MT6779V variant, but the parent chip is the Helio G90/G90T.
MT6758V	Mobile SoC (Helio P23)	Mid-range processor. It supports dual-SIM, dual 4G VoLTE.	Alcatel 3V 5032w, BLU R2 LTE, Nokia 3.1 Plus (Helio P23 is the common name)
MT6768V CU	Mobile SoC (Helio P65)	Mid-range processor often branded as the Helio P65 or Helio G80/G85 (which are closely related).	Samsung Galaxy A31 (Helio P65/MT6768), Xiaomi Redmi 9 (Helio G80/MT6769T is closely related)