AMAOE M15P-012 Reballing Stencil for Xiaomi 15 Pro

AMAOE M15P-012 Reballing Stencil for Xiaomi 15 Pro

AMAOE M15P-012 Reballing Stencil for Xiaomi 15 Pro

This is a professional-grade reballing stencil from AMAOE, designed for an advanced and highly specific repair: the middle layer of the Xiaomi 15 Pro motherboard. Crafted with the experience of repair professionals in mind, this patented tool is essential for complex, multi-layer board repairs.

Key Features & Benefits

• Dedicated to Xiaomi 15 Pro (中层网): This stencil is a precision tool specifically for the middle layer of the Xiaomi 15 Pro’s motherboard. Modern flagships use a “sandwich” design where the main CPU and other critical ICs are located in this layer, and a dedicated stencil is required for a successful repair.
• Strong Magnetic Properties (强磁性): A key innovation, the strong magnetic property allows the stencil to securely and quickly align with a magnetic reballing jig. This prevents any shifting or movement during the application of solder paste, a crucial benefit for the precision required in a middle-layer reballing job.
• Ultra-Precision 0.12mm Thickness: With an optimal thickness of 0.12mm, the stencil ensures the correct amount of solder paste is applied to the chip’s microscopic pads. This precision is essential for preventing shorts and creating a robust, reliable connection.
• Perfect Dimensions: The stencil’s size is 70x70mm, ensuring it perfectly fits a standard reballing jig while providing ample space for the middle layer’s components.
• Patented Design: The stencil’s core features are protected by a Chinese patent, reinforcing its status as a unique and professionally-developed tool that is made to solve specific repair challenges.

Technical Breakdown

• Model: M15P-012
• Material: Stainless Steel
• Pattern: Square
• Thickness: 0.12mm
• Color: Silver
• Item Weight: 30 g
• Country of Origin: China
• Net Quantity: 1
• Reusable: Yes
• Brand: AMAOE (阿毛易修)
• Compatible Device: Xiaomi 15 Pro Motherboard (middle layer)
• Likely Chipset: This stencil is designed for the chips in the middle layer of the Xiaomi 15 Pro, which is expected to include the Qualcomm Snapdragon 8 Gen 4 SoC.
• Dimensions: 70 x 70 mm
• Thickness: 0.12mm
• Special Features: Strong Magnetic Alignment, Patented Design
• Repair Scenario: This stencil is used to reball the BGA-packaged chips that connect the upper and lower halves of the Xiaomi 15 Pro’s motherboard. This is a common repair for issues like a phone that won’t turn on, gets stuck in a boot loop, or experiences a complete lack of power.