AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework

AMAOE EMMC:1– SUPPORTED ICS, CPU

BGA153
BGA162
BGA169
BGA186
BGA221
BGA254

300.00

Added to wishlistRemoved from wishlist 0
Add to compare

AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework

AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) - Professional Flash Memory Rework

 

 

AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework

 

The AMAOE EMMC 1 / EMCP Stencil is a premium, patented reballing tool from AMAOE (阿毛易修®), specifically designed for professional technicians to accurately rework and reball various mobile phone flash memory chips. Crafted from high-quality Japanese imported steel, this stencil provides the precision and durability required for intricate chip-level repairs.

Key Features:

  • Precision 0.15mm Thickness: Engineered for the delicate solder pad pitch of EMMC and EMCP memory chips, ensuring precise solder paste application and flawless solder ball formation.
  • Japanese Imported Steel Material: Guarantees superior durability, resistance to warping under high temperatures, and extended lifespan, making it a reliable tool for repeated use.
  • Patented Anti-Bulging Design: Features specialized heat dissipation holes with an anti-bulging design (). This innovative feature prevents the stencil from deforming or lifting during the heating process, ensuring consistent contact and perfect reballing results.
  • Comprehensive EMMC/EMCP Compatibility: This universal stencil supports a wide range of common EMMC and EMCP BGA packages, making it a versatile addition to any repair toolkit.

Supported BGA Packages (Memory Types):

  • BGA153: A very common package for EMMC and EMCP chips.
  • BGA162: Another widely used package for these memory types.
  • BGA169: Frequently found in various mobile devices.BGA186: Supports larger capacity EMMC/EMCP chips.
  • BGA221: Used for higher density EMMC/EMCP.
  • BGA254: The largest common package, often for high-capacity EMCP.

Why Choose AMAOE EMMC 1 / EMCP Stencil?

Developed “from the experience of repair technicians,” AMAOE tools are built to meet the rigorous demands of professional rework. The EMMC 1 / EMCP stencil streamlines the complex process of reballing flash memory (字库), enhancing efficiency and accuracy in critical data and storage component repairs. Invest in AMAOE for reliable, high-quality repair solutions.

Technical Specifications:

 

  • Material: Stainless Steel
  • Pattern: Square
  • Dimensions (W x H): 10 x 8 cm
  • Thickness: 0.12mm
  • Color: Silver
  • Item Weight: 50 g
  • Country of Origin: China
  • Net Quantity: 1
  • Reusable: Yes

 

shipping & delivery

Shipping & Delivery information :

Shipping Charges: A shipping fee of  RS 80  will be applied to orders

Time To Dispatch: We Prepare And Ship Your Product Within 1 Business Days.

Delivery Time (Estimated):

Within

Kerala 2 Days

Tamil Nadu 3 Days

Karnataka 3 Days

Maharashtra 3Days

Other State 4 To 7 Days

Shipping Partner Dtdc Courier

Tracking Link

logo

We Currently Ship Products Only Within India. You Can Place Orders From Across The World But Delivery Addresses Are Restricted To India.

We Ensure That We Deliver The Orders The Fastest And Depending On The Location Deliver Most Of The Orders In 2-7 Days.

In Case Of Any Incomplete Delivery Or Delivery Received That Is Not In Perfect Condition Please Contact Us Immediately At

Mobileicbinu@Gmail.Com    Or     Call 989533347

Cash On Delivery (Cod) Available

 

Advance Payment Rs 100

COD SHIPPING CHARGE RS150/- ALL INDIA

Thousand Rupees Above Order Full Amount Cod Available

Cash On Delivery Availability, Check Your City PinCod  

LINK

Location Finder

RURAL AREA, SHIPPING INDIAN SPEED POST 7 TO 12 DAY DELIVERY TIME

Tracking Link

User Reviews

0.0 out of 5
0
0
0
0
0
Write a review

There are no reviews yet.

Be the first to review “AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework”

Your email address will not be published. Required fields are marked *

AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework
AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework

300.00

YOUR CART

Billing details

India

India

Product Subtotal
S23+ S916U S911 stencil  × 1 300.00
IPhone CPU 2 QiAnLi A11 A12 A13 stencil  × 1 350.00
Subtotal 650.00
Total 700.00
  • it uses upi apps like bhim, paytm, google pay, phonepe or any banking upi app to make payment.
    if you need any help whatsapp 9895333473
    product delivery all india 3 to 7 days delivery time dtdc courier

Your personal data will be used to process your order, support your experience throughout this website, and for other purposes described in our privacy policy.

mobilestencil
Logo
Compare items
  • Total (0)
Compare
0
AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) - Professional Flash Memory Rework
AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) - Professional Flash Memory Rework
- +
300.00
2
Shopping cart