AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework
AMAOE EMMC:1– SUPPORTED ICS, CPU
BGA153
BGA162
BGA169
BGA186
BGA221
BGA254
₹300.00
AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework
AMAOE EMMC 1 / EMCP BGA Reballing Stencil (0.15mm) – Professional Flash Memory Rework
The AMAOE EMMC 1 / EMCP Stencil is a premium, patented reballing tool from AMAOE (阿毛易修®), specifically designed for professional technicians to accurately rework and reball various mobile phone flash memory chips. Crafted from high-quality Japanese imported steel, this stencil provides the precision and durability required for intricate chip-level repairs.
Key Features:
- Precision 0.15mm Thickness: Engineered for the delicate solder pad pitch of EMMC and EMCP memory chips, ensuring precise solder paste application and flawless solder ball formation.
- Japanese Imported Steel Material: Guarantees superior durability, resistance to warping under high temperatures, and extended lifespan, making it a reliable tool for repeated use.
- Patented Anti-Bulging Design: Features specialized heat dissipation holes with an anti-bulging design (). This innovative feature prevents the stencil from deforming or lifting during the heating process, ensuring consistent contact and perfect reballing results.
- Comprehensive EMMC/EMCP Compatibility: This universal stencil supports a wide range of common EMMC and EMCP BGA packages, making it a versatile addition to any repair toolkit.
Supported BGA Packages (Memory Types):
- BGA153: A very common package for EMMC and EMCP chips.
- BGA162: Another widely used package for these memory types.
- BGA169: Frequently found in various mobile devices.BGA186: Supports larger capacity EMMC/EMCP chips.
- BGA221: Used for higher density EMMC/EMCP.
- BGA254: The largest common package, often for high-capacity EMCP.
Why Choose AMAOE EMMC 1 / EMCP Stencil?
Developed “from the experience of repair technicians,” AMAOE tools are built to meet the rigorous demands of professional rework. The EMMC 1 / EMCP stencil streamlines the complex process of reballing flash memory (字库), enhancing efficiency and accuracy in critical data and storage component repairs. Invest in AMAOE for reliable, high-quality repair solutions.
Technical Specifications:
- Material: Stainless Steel
- Pattern: Square
- Dimensions (W x H): 10 x 8 cm
- Thickness: 0.12mm
- Color: Silver
- Item Weight: 50 g
- Country of Origin: China
- Net Quantity: 1
- Reusable: Yes
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