QSD12 SM7550 STENCIL SM7635 SM6450 SM4450 CPU STENCIL

This tool is used in electronics repair, specifically for reballing (reapplying solder balls) on Ball Grid Array (BGA) components like CPUs, eMMC, and other integrated circuits (ICs) found on phone and computer motherboards.

The text on the stencil includes:

• AMAOE (阿毛易修): The brand name.
• U-QSD12: The model number of the stencil.
• Patented Product (专利产品): This indicates that the design is legally protected.
• Qualcomm Snapdragon Processors: The text lists various compatible Qualcomm Snapdragon CPUs and other related ICs, such as SM7635, SM7550, and SM6450.
• UBGA Stencil Series (UBGA植锡专家系列): This describes the product line.
• 0.12MM: The size of the solder balls this stencil is designed for.
  

  Highlights

  For U-QSD12 STENCIL SM7635 SM7550 SM6450 SM4450 CPU STENCIL

  Brand ‎AMAOE

  Model ‎AMAOE  Qualcomm Snapdragon 7s Gen3/7Gen3/6Gen1/4Gen2, SM7635/SM7550/SM6450/SM4450 CPU STENCIL

  item model supporting ic cpu ram pa number

  U-QSD12

  5625M RR88643

  S55217 3385W7

  77052B

  77058D

  P2

  QDM5303 

  PM7250B

  8550VS

  WCN3988

  BGA254

  PM6150C

  PM755BAH

  WCN6755

  BGA153

  BGA200

  VC7643

  77051

  QPM8590

  SM7635

  SM7550

  SM6450

  SM4450

  PM4450 PM6450

  SDR735

  PM7550

  WCN6755

  PM7550

  SDR435

  SDR435

  RR88916

  QET6105

  LP8556

  QLN5030

  AW88257

  WCD9370

  SC8546

  PMK6450

  Qualcomm Snapdragon 7s Gen3/7Gen3/6Gen1/4Gen2, SM7635/SM7550/SM6450/SM4450 Integrated Network – 0.12mm

  ANTI-BULGING DESIGN OF HEAT DISSIPATION HOLES

  HUAFANG HISILICON HI CPU-0.12MM

  QSD12

  HALF-BLOCKING DESIGN

  Square Pattern

  stainless steel Material

  W x H: 10 x 8 cm

  Color: silver

  Specifications

  In The Box

  Number of Contents in Sales Package

  Pack of 1

  Country of Origin ‎China

  General

  Pattern Square

  Material stainless steel

  Suitable For Possible Value

  Re-usable Yes

  Net Quantity 1

  Dimensions

  Width 10 cm

  Height 8 cm

  Item Weight ‎50 g

   

Here’s an analysis of the provided list of part numbers, focusing on their probable function within a mobile device and identifying the associated Qualcomm platforms.

Identifying Part Numbers and Their Functions

The list contains a mix of Qualcomm system-on-a-chip (SoC) platforms, power management integrated circuits (PMICs), radio frequency (RF) front-end modules, and other components. Many of these are part of a specific Qualcomm “platform,” a set of chips designed to work together.

• SM7635/SM7550/SM6450/SM4450: These are the primary application processors or SoCs.
  • SM7635: This is likely the part number for the Snapdragon 7s Gen 3. The “SM” prefix is a common designator for Snapdragon mobile processors.
  • SM7550: This corresponds to the Snapdragon 7 Gen 3.
  • SM6450: This is the part number for the Snapdragon 6 Gen 1.
  • SM4450: This corresponds to the Snapdragon 4 Gen 2.
• PM7250B, PM6150C, PM755BAH, PM4450, PM6450, PM7550, PMK6450: These are Power Management Integrated Circuits (PMICs). Their job is to manage and distribute power to different parts of the system, including the main processor, memory, and peripherals. The “PM” prefix is a strong indicator of this function. PM4450 and PM6450 are likely companion PMICs for the SM4450 and SM6450 SoCs, respectively, and are sometimes packaged alongside them.
• WCN3988, WCN6755: These are likely Wireless Connectivity Network chips. They handle wireless technologies like Wi-Fi, Bluetooth, and possibly FM radio.
• QDM5303, QPM8590, QET6105, QLN5030, RR88643, RR88916, SDR735, SDR435: These are RF (Radio Frequency) components.
  • QPM/QDM: These prefixes often indicate Qualcomm RF Front-End Modules, which handle signal amplification, filtering, and switching for cellular antennas.
  • SDR: Stands for Software Defined Radio, which is a transceiver that handles the baseband processing for various cellular bands. SDR435 and SDR735 are likely paired with the Snapdragon 4 and 7 seriesplatforms, respectively.
  • RR: This prefix is often used for RF Receivers or related components.
• U-QSD12, S55217, 77052B, 77058D, 77051, P2, VC7643, LP8556, AW88257, WCD9370, SC8546, BGA254, BGA153, BGA200: These are a mix of different components.
  • BGA153, BGA200, BGA254: These are not specific chips but rather package types. BGA stands for Ball Grid Array, a type of surface-mount packaging used for integrated circuits. The numbers refer to the number of solder balls. This indicates the component’s physical form factor.
  • WCD9370: This is a Qualcomm audio codec, responsible for processing and managing audio signals for the speaker, microphone, and headphones.
  • AW88257: This is likely an audio amplifier from a third-party vendor like Awinic.
  • LP8556: This is probably a Linear Technology/Texas Instruments display driver or backlight controller.
  • SC8546: This could be a battery charging management IC.
  • The other numbers are likely other specialized components, such as memory controllers, display drivers, or smaller peripheral ICs.

Integrated Platform Analysis

The list explicitly mentions a Snapdragon 7s Gen 3/7 Gen 3/6 Gen 1/4 Gen 2 platform. The included part numbers, such as the various PMICs, RF components, and audio codecs, are all designed to work together to form a complete mobile device system. The core of this system is the primary SM processor, which is then supported by a suite of other Qualcomm and third-party chips to manage power, connectivity, and radio signals.